Develop-Etch-Strip / Dryfilm Strip – Etch – Tin Strip Process

PRODUCT CODE DESCRIPTION
Dryfilm Developer DEV668 An effective developing solution for dryfilm
Dryfilm Stripper 6608 A proprietary formulation for fast and effective stripping
Anti-foam NF388 Reduces foam in developing and stripping baths
Etchant Oxidizer SC35/CE49 NaClO3 based oxidizer for CuCl2 etching solution
Etchant Alkaline 5600 Fineline etchant alkaline based etching solution
Solder Stripper 4600 Nitric acid based solder stripper for effective and fast stripping

Cleaners / Anti Tarnish

PRODUCT CODE DESCRIPTION
MicroEtch Cleaner CE831 Excellent for removing tarnish and oxidation from copper surface
Acid Cleaner (Spray) SC726 Removal of copper oxides and organic residues from copper surface
Acid Cleaner (Dip) SC728 Removal of copper oxides and organic residues from copper surface
Alkaline Cleaner Cu803 Formulated as copper surface pre-cleaner prior to copper plating.
Copper Etch CE830/CE865 Oxy-sulfate microetch on copper surface removal of 1 micron
AntiTarnish (neutral) Cu822 Provides antitarnish finishing after PTH (Neutral)
AntiTarnish (acid) Cu823 Provides antitarnish finishing after PTH (Acidic)

DESMEAR / PTH / COPPER PLATING

PRODUCT CODE PROCESS
Solvent Sweller SW200 DESMEAR
Neutralizer NE300
Conditioner CD135 PTH
Pre-Dip PD145
Activator AT146
Accelerator AC148
Electroless Copper Cu150M
Cu150A
Cu150B
Copper Plating Cu400EX/ Cu200EX/400VCP Copper Plating
Tin Plating SN800EX/ SN820EX Tin Plating

Fluxes

PRODUCT CODE DESCRIPTION
Solder Assist Fluid 5016 Use as solder blanket oil for horizontal hot air process
Flux 900 Heat stable water-soluble flux specifically for use in a vertical hot air levelling process

FINISHING PROCESS

PRODUCT CODE PROCESS
Acid Cleaner SC726 OSP
OSP YL-DN-116A
Acid Cleaner KG511 ENIG
Activator KG529 / KG527
Electroless Nickel KG535 / KG531
Immersion Gold KG545Y

Desmear Process Sequence

  • Solvent Swell SW200
  • Double Rinse
  • Permanganate
  • Triple Rinse
  • Neutraliser NE300
  • Double Rinse

PTH process sequence

  • Clean/ Condition CD135
  • Hot water Rinse
  • Double Rinse
  • Micro-etching
  • Double Rinse
  • Pre-Dip PD145
  • Sn/Pd Activator AT146
  • Accelerator AC148
  • Double Rinse
  • Accelerator AC148
  • Double Rinse
  • Electroless Copper CU150M/A/B
  • Double Rinse

ACID COPPER PLATING : CUBOARD 400 EX

1. Operate at wide ranging current densities.
2. Excellent throwing power for high aspect ratios.
3. Excellent physical properties.
4. Consistent quality and long operating bath life.
5. Uniform plating distribution.
6. Low copper additive consumption and operating costs.
7. Excellent plating efficiencies with reduced copper anode consumption.
8. Very low anode sludge formation.
9. Ease of use with single component.

Organic Solderability Preservative [YL-DN-116A]

The OSP product YL-DN-116HT is compatible for dense and fine pitch PCB
and meets the requirement of lead free assembly process. It provides
excellent solderability, simple process flow and low operating costs

Acid Cleaner SC726
Rinse
Micro Etch
Rinse
Acid Dip
DI Water Rinse
OSP YL-DN-116A
DI Water Rinse
Dry

Electroless-Nickel-Immersion-Gold

Acid Cleaner KG511
Micro Etch
Acid Pre-Dip
AcRvator KG529/ KG527
Acid Post Dip
Electroless Nickel KG535 / KG531
Immersion Gold KG545Y

METAL SOLDERABILITY PRESERVATIVE