Standard

Etertec HT 100T and HT 100F

The HT 100 T and 100F series is widely applied to Printed Circuit manufacturing

Applications for print and etch, tent and etch or acid copper and etch resist plating process.

  • Excellence resistance to acid etchant
  • Excellence to known acid plating process
  • High resolution and adhesion
  • Easy to strip with small flake size
  • Wide operating latitude
  • Available film thickness of 30 microns, 38 microns and 50 microns

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Etertec E 9300 and 9400

The E 9300 and 9400 series is a high energy film with very high resolution and is widely applied to Printed Circuit manufacturing applications for print and etch, tent and etch and plating

Process.

  • Excellence resistance to acid etchant
  • Excellence to known acid plating process
  • Very high resolution and adhesion
  • Wide operating latitude
  • Available film thickness of 30 microns ,38 microns and 50 microns

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R2R Flex

Etertec HP 3800

The HP 3800 series is widely applied to R2R Flexible Circuit Manufacturing application

For print and etch, tent and etch and plating process.

  • Excellence resistance to acid etchant
  • Excellence to known acid plating process
  • Very fine resolution and adhesion
  • Wide operating latitude
  • Available film thickness of 15microns, 20 microns, 25 microns, 30 microns and 38 microns

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Alpho 202J

The Alpho 202J series is widely applied to R2R Flexible Circuit Manufacturing application

For print and etch, tent and etch and plating process.

  • Excellence resistance to acid etchant
  • Excellence to known acid plating process
  • Very fine resolution and adhesion
  • Wide operating latitude
  • Available film thickness of 25 microns and 30 microns and 38 microns

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Electrolytic nickel and gold and Electroless Nickel and Immersion Gold

Etertec HQ 6300

The HQ 6300 series is widely applied to electrolytic nickel and gold plating process.

  • Excellence resistance to acidic nickel plating solution
  • Good adhesion up to temperature of 60 degree C
  • Wide operating latitude
  • Available film thickness of 50 microns

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Etertec HQ 6200 and HQ 6500

The HQ 6200 and 6500 series is widely applied to electroless nickel and immersion gold plating process.

  • Excellence resistance to known electroless nickel plating solution
  • Good adhesion up to temperature of 85 degree C
  • Wide operating latitude
  • Available film thickness of 50 microns

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High Density Interconnect

Etertec HP 3600

The HP 3600 series is widely applied to substrate manufacturing application for thick copper and Solder plating process

  • Excellence resistance to known acid copper and tin plating solution
  • Good aspect resolution on via up to 50 microns ( depends on machine, 0.8 to 1.0)
  • Wide operating latitude
  • Available film thickness of 50 microns, 65 microns, 75 microns and 100 microns

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Etertec BR 40000

The BR 40000 series is widely applied to wafer bumping application for thick copper and Solder plating process

  • Excellence resistance to known acid copper and tin plating solution
  • Good aspect resolution on via up to 50 microns ( depends on machine, 0.8 to 1.0)
  • Wide operating latitude
  • Available film thickness of 50 microns, 75 microns, 115 microns and 300 microns

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Laser Direct Imaging Film

Etertec UDF 7100

The UDF 7100 series is designed for UV laser direct imaging application

  • Excellence resistance to acid etchant
  • For i-line wavelength (365nm)
  • Excellence to known acid plating process
  • Excellent fine resolution and adhesion
  • Wide operating latitude
  • Available film thickness of 20 microns and 25 microns

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Etertec UDF 7200M

The UDF 7200M series is designed for UV laser direct imaging application

  • Excellence resistance to acid etchant
  • For i-line wavelength (365nm)
  • Excellence to known acid plating process
  • Excellent fine resolution and adhesion
  • Wide operating latitude
  • Available film thickness of 25 microns and 50 microns

Please contact us for detail

Dry Film Soldermask

Dynamask DM 8500 and 8200

The Dynamask DM 8500 and 8200 series is widely applied to Printed Circuit manufacturing Application. The DM 8500 series is for rigid PCB and DM 8200 series is for Flex PCB.

  • Excellence chemical resistance
  • Excellence adhesion and resolution
  • Excellent temperature resistance during the assembly process
  • Wide operating latitude
  • Available film thickness of 15microns, 25 microns, 38microns and 50 microns

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Photosensitive Polyimide Film

Etertec PIC 3300 and EPD 3500

The PIC 3300 and EPD 3500 is a negative tone, fully polyimide structure and aqueous Developable film.

  • Excellence chemical resistance
  • Excellence adhesion and resolution
  • High Tg and low CTE
  • Wide operating latitude
  • Available film thickness of 25 microns and 30microns

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Touch Panel Film

Etertec TPR 2600

The TPR 2600 series is widely applied to touch panel manufacturing application

  • Excellence to ITO and metal etching resistance
  • Excellence adhesion and resolution
  • Wide operating latitude
  • Available film thickness of 15 microns and 20 microns

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Eternal DF Technology

LDI Film (UD900)

  • Function: Print&Etch & Plating
  • DF Thickness: 30,40,50,62 um
  • LDI ( Wave Length: 355 nm ) — Fast Photo speed ( 10~15 mj/cm2 )

UD-900 SEM for L/S = 40/40 um , 50% Break Point

Next Gen. DF for SAP

Thick Film

  • ETERTEC® BR 40000 Thick film
  • 60um/75um/120um
  • Excellent resolution : 30 um /75um thickness
  • Excellent resistance to Ni/Au and Alkaline etching.

DF Photo Resist

Eternal Photo Resist Catalog