| PRODUCT | CODE | DESCRIPTION |
| Dryfilm Developer | DEV668 | An effective developing solution for dryfilm |
| Dryfilm Stripper | 6608 | A proprietary formulation for fast and effective stripping |
| Anti-foam | NF388 | Reduces foam in developing and stripping baths |
| Etchant Oxidizer | SC35/CE49 | NaClO3 based oxidizer for CuCl2 etching solution |
| Etchant Alkaline | 5600 | Fineline etchant alkaline based etching solution |
| Solder Stripper | 4600 | Nitric acid based solder stripper for effective and fast stripping |
| PRODUCT | CODE | DESCRIPTION |
| MicroEtch Cleaner | CE831 | Excellent for removing tarnish and oxidation from copper surface |
| Acid Cleaner (Spray) | SC726 | Removal of copper oxides and organic residues from copper surface |
| Acid Cleaner (Dip) | SC728 | Removal of copper oxides and organic residues from copper surface |
| Alkaline Cleaner | Cu803 | Formulated as copper surface pre-cleaner prior to copper plating. |
| Copper Etch | CE830/CE865 | Oxy-sulfate microetch on copper surface removal of 1 micron |
| AntiTarnish (neutral) | Cu822 | Provides antitarnish finishing after PTH (Neutral) |
| AntiTarnish (acid) | Cu823 | Provides antitarnish finishing after PTH (Acidic) |
| PRODUCT | CODE | PROCESS |
| Solvent Sweller | SW200 | DESMEAR |
| Neutralizer | NE300 | |
| Conditioner | CD135 | PTH |
| Pre-Dip | PD145 | |
| Activator | AT146 | |
| Accelerator | AC148 | |
| Electroless Copper | Cu150M | |
| Cu150A | ||
| Cu150B | ||
| Copper Plating | Cu400EX/ Cu200EX/400VCP | Copper Plating |
| Tin Plating | SN800EX/ SN820EX | Tin Plating |
| PRODUCT CODE | DESCRIPTION |
| Solder Assist Fluid 5016 | Use as solder blanket oil for horizontal hot air process |
| Flux 900 | Heat stable water-soluble flux specifically for use in a vertical hot air levelling process |
| PRODUCT | CODE | PROCESS |
| Acid Cleaner | SC726 | OSP |
| OSP | YL-DN-116A | |
| Acid Cleaner | KG511 | ENIG |
| Activator | KG529 / KG527 | |
| Electroless Nickel | KG535 / KG531 | |
| Immersion Gold | KG545Y |
Desmear Process Sequence
- Solvent Swell SW200
- Double Rinse
- Permanganate
- Triple Rinse
- Neutraliser NE300
- Double Rinse
PTH process sequence
- Clean/ Condition CD135
- Hot water Rinse
- Double Rinse
- Micro-etching
- Double Rinse
- Pre-Dip PD145
- Sn/Pd Activator AT146
- Accelerator AC148
- Double Rinse
- Accelerator AC148
- Double Rinse
- Electroless Copper CU150M/A/B
- Double Rinse
2. Excellent throwing power for high aspect ratios.
3. Excellent physical properties.
4. Consistent quality and long operating bath life.
5. Uniform plating distribution.
6. Low copper additive consumption and operating costs.
7. Excellent plating efficiencies with reduced copper anode consumption.
8. Very low anode sludge formation.
9. Ease of use with single component.[/vc_column_text][/vc_column_inner][vc_column_inner width=”1/2″][vc_single_image image=”164″ img_size=”full” alignment=”center”][/vc_column_inner][/vc_row_inner][/vc_column][/vc_row][vc_row][vc_column width=”1/2″][vc_column_text]
Organic Solderability Preservative [YL-DN-116A]
The OSP product YL-DN-116HT is compatible for dense and fine pitch PCB
and meets the requirement of lead free assembly process. It provides
excellent solderability, simple process flow and low operating costs
Acid Cleaner SC726
Rinse
Micro Etch
Rinse
Acid Dip
DI Water Rinse
OSP YL-DN-116A
DI Water Rinse
Dry
Electroless-Nickel-Immersion-Gold
Acid Cleaner KG511
Micro Etch
Acid Pre-Dip
AcRvator KG529/ KG527
Acid Post Dip
Electroless Nickel KG535 / KG531
Immersion Gold KG545Y[/vc_column_text][vc_single_image image=”264″ img_size=”medium” alignment=”center”][/vc_column][/vc_row][vc_row full_width=”stretch_row” equal_height=”yes” content_placement=”top” css=”.vc_custom_1512123905652{background-color: #f2f2f2 !important;}”][vc_column][vc_text_separator title=”METAL SOLDERABILITY PRESERVATIVE” add_icon=”true”][vc_single_image image=”170″ img_size=”full” alignment=”center”][vc_single_image image=”268″ img_size=”large” alignment=”center”][/vc_column][/vc_row]